Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same

ABSTRACT

A connective structure for bonding semiconductor devices and methods for forming the same are provided. The bonding structure includes an alpad structure, i.e., a thick aluminum-containing connective pad, and a substructure beneath the aluminum-containing pad that includes at least a pre-metal layer and a barrier layer. The pre-metal layer is a dense material layer and includes a density greater than the barrier layer and is a low surface roughness film. The high density pre-metal layer prevents plasma damage from producing charges in underlying dielectric materials or destroying subjacent semiconductor devices.

TECHNICAL FIELD

The disclosure relates, most generally, to semiconductor devices andmethods for forming the same. More particularly, the disclosure relatesto semiconductor devices that are resistant to plasma damage and includea high density, low roughness film, and methods for forming the same.

BACKGROUND

Semiconductor devices are used in various electronic and other devicesthroughout the world. Once the semiconductor device fabrication processis completed, the fabricated semiconductor device is coupled to externalcomponents using various assembly processes. One common assembly processis a bonding process whereby the semiconductor device is bonded to abonding wire or a bumping material such as a solder bump or solder ball.

Semiconductor devices include one or numerous conductive metal layers.The conductive metal layers serve as wiring layers and couple thevarious device components to one another through dielectric materials.The conductive metal layers are formed over one another and at variousdevice levels. Each semiconductor device includes an uppermost, topmetal wiring layer. The top metal wiring layer of the semiconductordevice must be coupled to a solder bump or other external component aspart of the assembly process and in order for the semiconductor deviceto be utilized. Some connective technologies utilize thick materiallayers or other processes such as lengthy deposition processes, that cancause plasma damage to the semiconductor device. The plasma can chargethe dielectric materials formed over the top metal layer and propagatethrough the metal layers and to transistors and other devices formed onthe substrate or between the metal layers, through an antenna-typeeffect. When this charge undesirably reaches metal gate or othertransistors formed in the semiconductor device, including on thesubstrate, this charge can cause blowout of the gate and destruction ofthe functionality of the transistor and of the entire semiconductordevice.

It would be desirable to provide assembly methods and connectivestructures in which plasma damage to the transistors and othercomponents of the semiconductor device, is prevented.

BRIEF DESCRIPTION OF THE DRAWING

The present disclosure is best understood from the following detaileddescription when read in conjunction with the accompanying drawing. Itis emphasized that, according to common practice, the various featuresof the drawing are not necessarily to scale. On the contrary, thedimensions of the various features may be arbitrarily expanded orreduced for clarity. Like numerals denote like features throughout thespecification and drawing.

FIG. 1 is a cross-sectional view showing a portion of a semiconductordevice including an alpad structure according to the disclosure;

FIG. 2 is a cross-sectional view showing a step in the method of formingan alpad structure according to the disclosure;

FIG. 3 is a cross-sectional view showing an alpad structure according tothe disclosure; and

FIG. 4 is a flow chart showing a method for forming an embodiment of analpad according to the disclosure.

DETAILED DESCRIPTION

The disclosure provides a connective structure for coupling asemiconductor device to a solder ball or bonding wire and a method forforming the structure. The structure includes Alpad technology with arelatively thick aluminum-containing contact pad over the devicemetallization layers and this aluminum-containing contact pad (“Alpad”)is coupled to the solder ball or bonding wire. A dielectric is disposedover the top metal layer of the semiconductor device and a compositematerial of a dense layer and a barrier material layer is disposedbetween the dielectric layer and the aluminum-containing contact pad.The dense material layer is formed of the same material as the barrierlayer in some embodiments and they are formed of different materials inother embodiments. The dense material layer is a high density/lowroughness film that prevents plasma induced charging of the subjacentdielectric materials and subjacent electronic components. The densematerial layer is formed using a comparatively low energy process.

FIG. 1 is a cross sectional view showing a portion of an embodiment of asemiconductor device formed on and over substrate 2. Various suitablesemiconductor and other materials are used for substrate 2 in variousembodiments. In one embodiment, substrate 2 is formed of silicon butother suitable materials are used in other embodiments. Thesemiconductor device formed on and over substrate 2 is an integratedcircuit in some embodiments and various other semiconductor devices inother embodiments. The semiconductor device includes multiple metalinterconnect layers. Various metals such as aluminum, aluminum silicon,copper, and various alloys are used as the metal layers. In someembodiments, the semiconductor device includes about five to ten metallayers but fewer or more metal layers are used in other embodiments.

In the illustrated embodiment of FIG. 1, there are a maximum of tenmetal layers but other numbers of metal layers are used in otherembodiments. The ten metal layers 4 include top metal layer 4T and metallayers 4 are coupled to one other by vias 8 but other metal-to-metalinterconnect features are used in other embodiments. In one embodiment,the ten metal layers 4 are each formed of the same material and in otherembodiments, the ten metal layers 4 are formed of different materials.In one embodiment, each metal layer 4 is formed of copper. In anotherembodiment, each metal layer 4 is formed of aluminum but other suitableconductive films are used in other embodiments. Metal layers 4 areseparated from one another by a dielectric material. Various suitabledielectric materials such as oxides, nitrides, oxynitrides, high-kdielectrics, and other suitable dielectric materials are used. The sameor different dielectric materials are used to separate the various metallayers 4 and the nature of the dielectric material is determined, atleast in part, by the type of metal being isolated by the dielectricmaterials.

Vias 8 extend through the dielectric layers to couple metal layers 4 andare formed of various suitable conductive materials such as but notlimited to aluminum, aluminum silicon, copper, aluminum copper andvarious alloys. In some embodiments, vias 8 include barrier typematerials such as tungsten, W, or other suitable barrier materials, asliners. Various methods are used to form metal layers 4, vias 8 and thedielectric materials disposed between the conductive features.

Top metal layer 4T is the tenth metal layer in the illustratedembodiment but in other embodiments, different numbers of metal layersare used and thus, the top metal layer represents a differentmetallization layer in other embodiments. In the illustrated embodimentof FIG. 1, there are ten metal layers including top metal layer 4T butin some portions, the tenth metal layer is not present and there areonly nine metal layers 4. Stated alternatively, in some portions, thetenth, top metal layer 4T is not needed and the ninth metal layer is theuppermost metal layer. MOS transistor 6 is coupled to metal layers 4 byconductive structure 12. Conductive structure 12 is a contact or othersuitable conductive structure in other embodiments. MOS transistor 6 isa metal gate transistor in some embodiments and MOS transistor 6 is apolysilicon gate transistor in other embodiments and in still otherembodiments, MOS transistor 6 is a floating-gate transistor with anupper gate and a floating gate, each formed of silicon or other suitablematerials. In still other embodiments, MOS transistor 6 is formed ofother materials. MOS transistor 6 is representative of a multitude ofMOS transistors and other devices and components that are present andcombine to form the semiconductor device.

Antenna structure 10 includes two metal layers 4 coupled by via 8 andrepresents a structure sensitive to the “antenna effect.” The antennaeffect involves charging in a discrete conductive layer region formedover the surface of a substrate that causes excessive current that cancharge and damage the characteristics of underlying dielectricmaterials. Plasma etching and various deposition processes involving aglow discharge naturally result in electric charging in some regions ofthe upper substrate surface and cause the antenna effect. The resulting“antenna effect” causes excessive current by which the characteristicsof an oxide or other dielectric layer located beneath the conductivelayer can be severely degraded, and which can further cause blowout ofunderlying conductive or semiconductor components. The antenna effectoccurs when conductive feature act as “antennas” amplifying the chargingeffect. Antenna structure 10 represents one embodiment of a conductivestructure that acts as an antenna. FIG. 1 shows that antenna structure10 utilizes metal layers M8 and M9 in a portion of the device wheremetal layer M9 is the uppermost layer. In other embodiments, antennastructure 10 represents a structure formed in portions of the devicethat include top metal layer 4T and in those regions, antenna structure10 may utilize top metal layer 4T and one or more subjacent metallayers. The antenna effect may be produced as a result of structures atvarious metal levels of the semiconductor device formed on substrate 2.In other embodiments, various other structures serve as antennas.

FIG. 1 also shows dielectric layer 16 formed over upper surface 14 oftop metal layer 4T and connective structure 18 formed over dielectriclayer 16. Connective structure 18 includes first dense barrier layer 22,second barrier layer 28, and conductive pad layer 34. These materialsare shown in more detail in FIG. 2. Connective structure 18 anddielectric layer 16 are formed over the semiconductor device which mayalternatively be referred to as the device substructure.

FIG. 2 shows an embodiment of a structure upon which connectivestructure 18 is formed. In FIG. 2, only a portion of dielectric layer 16and connective structure 18 are shown in the illustrated embodiment butit should be understood that in other portions of the semiconductordevice, an opening extends through dielectric layer 16 and a via orother connective structure couples at least a conductive pad ofconductive pad layer 34 to top metal layer 4T through dielectric layer16.

FIG. 2 schematically shows top metal layer 4T disposed over devicestructure 36. In some embodiments, device structure 36 is the gate ofMOS transistor 6 shown in FIG. 1. In one embodiment, device structure 36is a metal gate, in another embodiment, device structure 36 is apolysilicon gate, and in yet another embodiment, device structure 36 isformed of other materials. Device structure 36 is also an upper gate ofa floating gate electrode and formed of various suitable materials, inother embodiments. In other embodiments, device structure 36 representsother semiconductor device structures that are sensitive to plasmadamage such as may be experienced due to the antenna effect. Structure40 schematically represents device structure between top metal layer 4Tand device structure 36. Structure 40 may essentially represent thestructure shown in FIG. 1 in one embodiment. In other embodiments,structure 40 includes various semiconductor device components,interconnect materials and structures, dielectric materials and otherstructures. In some embodiments, structure 40 includes variouselectrical connections between top metal layer 4T and device structure36.

Dielectric layer 16 is formed over upper surface 14 of top metal layer4T. Various suitable dielectric materials such as oxides, nitrides,oxynitrides, high-k dielectrics, and other suitable dielectric materialsare used for dielectric layer 16. Dielectric layer 16 is formed usingvarious methods and includes various thicknesses. Connective structure18 is formed over dielectric layer 16 as will be shown in FIG. 3.

Referring to FIG. 3, connective structure 18 includes a high density,low roughness first dense barrier layer 22 formed using a low energydeposition process, and second barrier layer 28 which includes a lowerdensity than first dense barrier layer 22. Together, first dense barrierlayer 22 and second barrier layer 28 form a composite barrier layer.Second barrier layer 28 includes a rougher surface than first densebarrier layer 22 and is formed using a deposition process that uses ahigher power than the deposition process used to form first densebarrier layer 22 and form a composite barrier layer structure.

In one embodiment, first dense barrier layer 22 and second barrier layer28 are formed of the same material but wherein first dense barrier layer22 has a higher density and lower surface roughness than second barrierlayer 28. First dense barrier layer 22 is therefore formed ofbarrier-type material in various embodiments and can be described as a“dense” film layer. In other embodiments, first dense barrier layer 22and second barrier layer 28 are formed of different materials. Suitablematerials used for either or both of first dense barrier layer 22 andsecond barrier layer 28 include Ta, TaN, TiN, Ti, In, and Ga,combinations thereof, but other suitable refractory metals and compoundsformed of refractory metals are used in other embodiments. In oneembodiment in which first dense barrier layer 22 and second barrierlayer 28 are formed of the same material, a continuous depositionprocess is carried out in one process chamber, whereby one or some ofthe process parameters and/or process conditions remain the same and oneor some of the process parameters and/or process conditions are changedto effectuate the deposition of the two distinct films—first densebarrier layer 22 and second barrier layer 28. According to thisembodiment, throughput is maximized and processing time is minimized. Inone embodiment, the processes for the deposition of the two distinctfilms include the same process gases and differ by only one or severalprocessing parameters such as temperature, pressure or power. In oneembodiment, atomic layer deposition, ALD is used to form either or bothof first dense barrier layer 22 and second barrier layer 28. In otherembodiments, either or both of first dense barrier layer 22 and secondbarrier layer 28 are formed using chemical vapor deposition, CVD orsputtering, i.e., physical vapor deposition.

According to some embodiments, first dense barrier layer 22 is formedusing a deposition process that utilizes various process gases andincludes a temperature within a range of about 50-300° C. but othertemperatures are used in other embodiments. The pressure in thedeposition chamber for the first dense barrier layer 22 depositionprocess ranges from about 1-9 E⁻³ torr to about 1-9 E⁻⁵ torr in someembodiments but other pressures are used in other embodiments. In someembodiments, the power used in the first dense barrier layer 22deposition process ranges from about 10 W to about 1000 W but otherpowers are used in other embodiments.

According to some embodiments, second barrier layer 28 is formed using adeposition process that utilizes various process gases and includes atemperature within a range of about 50-300° C. but other temperaturesare used in other embodiments. The process gases are the same as thoseused to form first dense barrier layer 22, in some embodiments. Thepressure in the deposition chamber for the second barrier layer 28deposition process ranges from about 1-9 E⁻³ torr to about 1-9 E⁻⁵ torrin some embodiments but other pressures are used in other embodiments.In some embodiments, the power used in the second barrier layer 28deposition process ranges from about 1000 W to about 6000 W but otherpowers are used in other embodiments.

The power used in the deposition process used to form first densebarrier layer 22 is a lower power than the power used to form secondbarrier layer 28 in most embodiments and the deposition pressure used toform first dense barrier layer 22 is a higher pressure than the pressureused in the deposition process used to form second barrier layer 28. Inone embodiment, the deposition processes for forming first dense barrierlayer 22 and second barrier layer 28 differ by the addition of argon tothe first dense barrier layer 22 deposition process or the use of agreater amount, i.e. higher gas flow, of argon in the first densebarrier layer 22 deposition process. Additional argon increases thepressure in the deposition chamber and the density of the formed filmlayer.

In one embodiment, thickness 24 of first dense barrier layer 22 is about50 angstroms and in other embodiments, thicknesses of about 25-100angstroms are produced, and in still other embodiments, otherthicknesses are used. First dense barrier layer 22 is a high density,low roughness film. Upper surface 26 of first dense barrier layer 22includes a surface roughness of about 4.5 nm in one embodiment, asurface roughness of about less than about 5 nm in another embodimentand other surface roughnesses in other embodiments. First dense barrierlayer 22 includes a density of about 20 g/cm³ in one embodiment, adensity of about 18-22 g/cm³, a density of about 15-25 g/cm³ in otherembodiments and still other densities in other embodiments.

In one embodiment, thickness 30 of second barrier layer 28 is about 600angstroms and in other embodiments, thicknesses of about 500-700angstroms are used and in still other embodiments, other thicknesses areused. Second barrier layer 28 is a low density, high roughness filmcompared to first dense barrier layer 22 and includes a lower densitythan first dense barrier layer 22 and a higher roughness than firstdense barrier layer 22. Upper surface 32 of second barrier layer 28includes a surface roughness of about 9 nm in one embodiment, a surfaceroughness of about 5-22 nm in other embodiments and other surfaceroughnesses in other embodiments. Second barrier layer 28 includes adensity of about 10 g/cm³ in one embodiment, a density of about 5-15g/cm³ in other embodiments and still other densities in otherembodiments.

According to embodiments in which first dense barrier layer 22 andsecond barrier layer 28 are formed of the same material and according toembodiments in which first dense barrier layer 22 and second barrierlayer 28 are formed of a different material, first dense barrier layer22 includes a higher density and a lower surface roughness than secondbarrier layer 28.

Conductive pad layer 34 is an aluminum-containing material and isaluminum in one embodiment. Conductive pad layer 34 is formed of variousaluminum alloys in other embodiments. In one embodiment, conductive padlayer 34 is formed of aluminum copper. In one embodiment, conductive padlayer 34 includes a thickness of about 28K angstroms, in otherembodiments, conductive pad layer 34 includes a thickness ranging fromabout 20-40K angstroms and conductive pad layer 34 includes otherthicknesses in other embodiments. Conductive pad layer 34 is formedusing various film deposition processes in various embodiments. In oneembodiment, sputtering, i.e. physical vapor deposition is used. Thedeposition process used to form conductive pad layer 34 is a blanketdeposition process and not a spatially selective deposition process.This is also true for previously described processes used to form firstdense barrier layer 22 and second barrier layer 28. After deposition,conductive pad layer 34 and second barrier layer 28 and first densebarrier layer 22 may be patterned to produce discrete conductive padsthat are bonded to solder balls, bonding wires or other connectivefeatures that couple the semiconductor device to external components.

Regardless of the power used and plasma energy produced during theformation of conductive pad layer 34 and the patterning of theconnective structure 18 by reactive ion etching or other plasma etchingtechniques, the semiconductor device below the composite structure offirst dense barrier layer 22 and second barrier layer 28 is protectedfrom plasma damage. Although not illustrated in FIG. 2, after discretepads are formed from conductive pad layer 34, upper surface 44 ofconductive pad layer 34 is directly bonded to solder or various bondingwires in various embodiments.

In the illustrated embodiment, connective structure 18 includes threematerial layers including the high density/low surface roughness firstdense barrier layer 22, second barrier layer 28 and conductive pad layer34. In other embodiments, additional layers are used. The additionalmaterial layer or layers are disposed underneath first dense barrierlayer 22 in some embodiments, between first dense barrier layer 22 andsecond barrier layer 28 in other embodiments, and over second barrierlayer 28 in still other embodiments.

FIG. 4 is a flow chart showing aspects of the method used to form analpad according to an embodiment of the disclosure. At formsemiconductor device step 102, a semiconductor device with multiplemetal layers is formed. Various methods are used to form various typesof semiconductor devices in various embodiments. The semiconductordevices include various components including metal gate transistordevices in some embodiments, and include a top metal layer. At formdielectric material step 104, a dielectric layer is formed over the topmetal layer of the semiconductor device. Various methods and variousdielectric materials are used. At deposit dense material portion ofcomposite barrier layer step 106, first dense barrier layer 22 is formedas described above. At deposit lower density material portion ofcomposite barrier layer step 108, second barrier layer 28 is formed asdescribed above. At deposit aluminum containing pad layer step 110, thealuminum-containing layer is formed. The structure is then patterned toform a conductive structure such as connective structure 18 of FIG. 1and at bond aluminum containing pad step 112, the connective structureis coupled by soldering or other suitable means, to a solder ball,bonding wire or other component coupled to outside components. Thebonding may form a part of a packaging method in some embodiments.

According to some aspects, the disclosure provides a semiconductordevice comprising: a semiconductor device having at least one metallayer including a top metal layer; a dielectric material disposed overthe top metal layer; a dense material layer disposed over the dielectricmaterial, the dense material layer comprising a high-density,low-roughness barrier-type material; a barrier layer disposed over thedense material layer; and an aluminum-containing connective pad disposedover the barrier layer.

In some embodiments, the dense material layer and the barrier layer areformed of the same material and have different densities and the barrierlayer is disposed directly on the dense material layer.

In some embodiments, the semiconductor device further comprises thealuminum connective pad coupled to the top metal layer through anopening that extends at least through the dielectric material andfurther contacting a solder bump and wherein each of the dense materiallayer and the barrier layer is formed of TaN and the aluminum-containingconnective pad has a thickness in a range of about 20K-40K angstroms.

In some embodiments, the at least one metal layer comprises 5-10 metallayers and the semiconductor device includes a plurality of metal gateMOS transistors.

In some embodiments, the dense material layer includes a density ofabout 18-22 g/cm³.

In some embodiments, the dense material layer includes a density greaterthan a density of the barrier layer.

In some embodiments, the dense material layer includes a thickness ofabout 25-100 angstroms, the barrier layer includes a thickness in arange of about 500-700 angstroms and the aluminum-containing connectivepad is coupled to the top metal layer through an opening that extends atleast through the dielectric material.

In some embodiments, the dense material layer is formed of a firstmaterial, the barrier layer is formed of the first material, the densematerial layer includes a density greater than a density of the barrierlayer and the first material comprises one of Ta, TaN, Ti, and TiN.

In some embodiments, the dense material layer includes a surfaceroughness less than about 5 nm.

In some embodiments, the barrier layer includes a surface roughnessgreater than the dense material layer surface roughness and within arange of about 8-15 nm.

According to some aspects, the disclosure provides a method for forminga semiconductor device, the method comprising: forming a semiconductordevice with at least one metal layer including a top metal layer;forming a dielectric material over the top metal layer; depositing adense material layer using a deposition process including a low power,process gases and further deposition parameters; depositing a barrierlayer having a lower density than the dense material, over the densematerial layer using a further deposition process using the processgases and the further deposition parameters and a higher power than thelow power; and depositing an aluminum-containing connective layer overthe barrier layer.

In some embodiments, the method further comprises forming an openingthrough the dielectric material prior to the depositing and wherein atleast the aluminum containing connective pad is coupled to the top metallayer through a conductive structure within the opening and wherein thedeposition process includes a higher pressure than the furtherdeposition process.

In some embodiments, the depositing a dense material layer includesdepositing a first material having a thickness of about 25-100 angstromsand a surface roughness less than about 5 nm and the depositing abarrier layer includes depositing the first material having a thicknessof about 500-700 angstroms and a surface roughness within the range ofabout 8-15 nm, and wherein the first material comprises one of Ta, TaN,Ti, and TiN.

In some embodiments, the depositing a dense material uses a power in therange of about 10 W to about 1000 W and a pressure in the range of about1-9 E⁻³ torr to 1-9 E⁻⁵ torr and the depositing a barrier layer includesa power of about 1000 W to about 6000 W and a pressure of about 1-9 E⁻³torr to about 1-9 E⁵ ⁻torr.

In some embodiments, the depositing a dense material layer and thedepositing a barrier layer each comprise one of atomic layer deposition(ALD), chemical vapor deposition (CVD) and sputtering.

According to some aspects, the disclosure provides a method for forminga semiconductor device. The method comprises: forming a semiconductordevice with at least one metal layer including a top metal layer;forming a dielectric material over the top metal layer; forming a densematerial layer of a first material and having a density of about 18-22g/cm³ over the dielectric material layer using a first depositionprocess; forming a barrier layer of the first material, on the densematerial layer using a second deposition process, the second depositionprocess including a higher power and a lower pressure than the firstdeposition process; and forming an aluminum-containing connective layerover the barrier layer.

In some embodiments, each of the first deposition process and the seconddeposition process comprises one of atomic layer deposition, chemicalvapor deposition (CVD), and sputtering.

In some embodiments, the barrier layer includes a density of less thanabout 15 g/cm³ and the first material is TaN.

In some embodiments, the forming a dense material layer includes a powerranging from about 10 W to about 1000 W and a pressure ranging fromabout 1-9 E⁻³ torr to about 1-9 E⁻⁵ torr and the forming a barrier layerincludes a pressure of about 1-9 E⁻³ torr to about 1-9 E⁻⁵ torr and apower of about 1000 W to about 6000 W

In some embodiments, the first material is one of Ta, TaN, Ti, and TiN,the forming a dense material layer includes a deposition pressure beinggreater than a deposition pressure of the forming a barrier layer andthe dense material layer includes a surface roughness less than asurface roughness of the barrier layer.

The preceding merely illustrates the principles of the disclosure. Itwill thus be appreciated that those of ordinary skill in the art will beable to devise various arrangements which, although not explicitlydescribed or shown herein, embody the principles of the disclosure andare included within its spirit and scope. Furthermore, all examples andconditional language recited herein are principally intended expresslyto be only for pedagogical purposes and to aid the reader inunderstanding the principles of the disclosure and the conceptscontributed by the inventors to furthering the art, and are to beconstrued as being without limitation to such specifically recitedexamples and conditions. Moreover, all statements herein recitingprinciples, aspects, and embodiments of the disclosure, as well asspecific examples thereof, are intended to encompass both structural andfunctional equivalents thereof. Additionally, it is intended that suchequivalents include both currently known equivalents and equivalentsdeveloped in the future, i.e., any elements developed that perform thesame function, regardless of structure.

This description of the exemplary embodiments is intended to be read inconnection with the figures of the accompanying drawing, which are to beconsidered part of the entire written description. In the description,relative terms such as “lower,” “upper,” “horizontal,” “vertical,”“above,” “below,” “up,” “down,” “top” and “bottom” as well asderivatives thereof (e.g., “horizontally,” “downwardly,” “upwardly,”etc.) should be construed to refer to the orientation as then describedor as shown in the drawing under discussion. These relative terms arefor convenience of description and do not require that the device orstructure be constructed or operated in a particular orientation. Termsconcerning attachments, coupling and the like, such as “connected” and“interconnected,” refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, unless expressly described otherwise.

Although the disclosure has been described in terms of exemplaryembodiments, it is not limited thereto. Rather, the appended claimsshould be construed broadly, to include other variants and embodimentsof the disclosure, which may be made by those of ordinary skill in theart without departing from the scope and range of equivalents of thedisclosure.

What is claimed is:
 1. A semiconductor device comprising: asemiconductor device having at least one metal layer including a topmetal layer; a dielectric material disposed over said top metal layer; adense material layer disposed over said dielectric material, said densematerial layer comprising a high-density, low-roughness barrier-typematerial; a barrier layer disposed over said dense material layer; andan aluminum-containing connective pad disposed over said barrier layer,said dense material layer and said barrier layer formed of the samematerial and said dense material layer having a greater density thansaid barrier layer.
 2. The semiconductor device as in claim 1, whereinsaid barrier layer is disposed directly on said dense material layer. 3.The semiconductor device as in claim 1, wherein said at least one metallayer comprises 5-10 metal layers and said semiconductor device includesa plurality of metal gate MOS transistors.
 4. The semiconductor deviceas in claim 3, wherein said dense material layer includes a density ofabout 18-22 g/cm³.
 5. The semiconductor device as in claim 4, whereinsaid dense material layer includes a surface roughness less than asurface roughness of said barrier layer.
 6. The semiconductor device asin claim 4, wherein said dense material layer includes a thickness ofabout 25-100 angstroms, said barrier layer includes a thickness in arange of about 500-700 angstroms and said aluminum-containing connectivepad is coupled to said top metal layer through an opening that extendsat least through said dielectric material.
 7. The semiconductor deviceas in claim 1, wherein said dense material layer and said barrier layerare each formed of a first material, and said first material comprisesone of Ta, TaN, Ti, and TiN.
 8. The semiconductor device as in claim 1,wherein said dense material layer includes a surface roughness less thanabout 5 nm.
 9. The semiconductor device as in claim 8, wherein saidbarrier layer includes a surface roughness greater than said surfaceroughness of said dense material layer and within a range of about 8-15nm.
 10. The semiconductor device as in claim 1, further comprising saidaluminum-containing connective pad coupled to said top metal layerthrough an opening that extends at least through said dielectricmaterial and further contacting a solder bump and wherein each of saiddense material layer and said barrier layer is formed of TaN and saidaluminum-containing connective pad has a thickness in a range of about20K-40K angstroms.
 11. A semiconductor device comprising: asemiconductor device having at least one metal layer including a topmetal layer; a dielectric material disposed over said top metal layer; adense material layer disposed over said dielectric material, said densematerial layer comprising a high-density, low-roughness barrier-typematerial; a barrier layer disposed over said dense material layer andformed of the same material as said dense material layer; and analuminum-containing connective pad disposed over said barrier layer,wherein said dense material layer includes a density greater than adensity of said barrier layer.
 12. The semiconductor device as in claim11, wherein said barrier layer is disposed directly on said densematerial layer.
 13. The semiconductor device as in claim 11, whereinsaid dense material layer includes a surface roughness less than asurface roughness of said barrier layer.
 14. The semiconductor device asin claim 11, wherein said aluminum-containing connective pad is coupledto said top metal layer through an opening that extends at least throughsaid dielectric material.
 15. The semiconductor device as in claim 11,wherein said dense material and said barrier layer are each formed ofone of Ta, TaN, Ti, and TiN and said dense material layer includes asurface roughness less than about 5 nm.
 16. A semiconductor devicecomprising: a semiconductor device having a plurality of metal layersincluding a top metal layer; an antenna structure formed of two of saidmetal layers disposed beneath said top metal layer in a first deviceregion; a dielectric material disposed over said top metal layer; adense material layer disposed over said dielectric material in a seconddevice region, said dense material layer comprising a high-density,low-roughness barrier-type material; a barrier layer disposed over saiddense material layer and formed of the same material as said densematerial layer; and an aluminum-containing connective pad disposed oversaid barrier layer, wherein said dense material layer includes a surfaceroughness less than a surface roughness of said barrier layer and agreater density than said barrier layer.
 17. The semiconductor device asin claim 16, wherein said barrier layer is disposed directly on saiddense material layer.
 18. The semiconductor device as in claim 16,wherein said dense material and said barrier layer are each formed ofone of Ta, TaN, Ti, In, Ga and TiN and said dense material layerincludes a surface roughness less than about 5 nm.
 19. The semiconductordevice as in claim 16, claim 1, wherein said dense material layerincludes a surface roughness less than about 5 nm and said barrier layerincludes a surface roughness within a range of about 8-15 nm.
 20. Thesemiconductor device as in claim 16, further comprising saidaluminum-containing connective pad coupled to said top metal layerthrough an opening that extends at least through said dielectricmaterial and further contacting a solder bump and wherein each of saiddense material layer and said barrier layer is formed of TaN and saidaluminum-containing connective pad has a thickness in a range of about20K-40K angstroms.